Navigating the SOSA Technical Standard 1.0 for Interconnect Selection
Current open standards for systems architecture leave a great deal of room for interpretation. Ensuring interoperability as well as reducing development time and cost has historically been an issue. This whitepaper discusses how to navigate the Sensor Open Systems Architecture (SOSA) standard for interconnect selection. Learn how TE Connectivity is participating in the SOSA Consortium as a key part of this effort to facilitate interoperability, reuse and rapid technology insertion for faster development and time-to-market.
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onsemi M 1 1200 V SiC MOSFETs & Modules: Characteristics and Driving Recommendations
SiC MOSFETs are quickly proliferating in the power semiconductor market as some of the initial reliability concerns have been resolved and the price level has reached a very attractive point. As more devices become available in the market, it is important to understand both the commonalities and the differences with IGBTs so that the user can get the most out of each device. This paper provides an overview on the key characteristics of onsemi M 1 1200 V SiC MOSFETs and how they can be influenced by the driving conditions. As part of the full wi ...
Performance Comparison of 1200 V SiC MOSFET and Si IGBT Used in Power Integrated Module for 1100 V Solar Boost Stage
This application note compares the performance of two power integrated modules (PIMs) in the boost stage of an 1100 V solar inverter. One PIM used state−of−the−art silicon 1200 V IGBT (part number NXH100B120H3Q0 defined as PIM−IGBT and the other PIM used a new 1200 V SiC MOSFET (part number NXH40B120MNQ0 defined as PIM−SIC. These two PIMs utilized the same Q0 package technology and SiC Schottky boost diode. They are pin−to−pin compatible allowing customers to upgrade from Si IGBT to the SiC MOSFET version. Due to faster switching characteristic ...
THE ROUTE TO MASSIVE IoT
Connectivity is now truly ubiquitous. All verticals, without exception, are converging on a future where productivity becomes universally data driven. The devices that will enable these intelligent and connected endpoints will be hugely diverse in their design but share many common features. This combination of uniformity and uniqueness is both an opportunity and a challenge for OEMs looking to leverage the massive IoT.
Learn how to move from proof-of-concept to as-a-service IoT deployment with IoTConnect on AWS. This whitepaper has the answ ...
THE MODERN MEETING ENVIRONMENT
Work patterns have changed forever and modern working, with people able to work from a variety of locations, is here to stay. Many of us have become used to working remotely and collaborating via video and instant messaging. We’ve remained productive, but perhaps at the cost of losing some of the natural, personal interactions that make working in a team so enjoyable. Occasional technical glitches can sometimes dampen the experience and the pressure to be always available can be overwhelming. ...
Learn more about the benefits of an Exposure Management Platform for APAC enterprises
An Infographic brought to you by Tenable with research insights by IDC.
In this infographic, you will find:
• Proactive approach taken by Asia Pacific enterprises in their cybersecurity transformation initiatives
• Top areas where Asia Pacific organizations invest to bolster their cyber defenses
• Benefits of an exposure management platform
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